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VEHITS 2017 will be held in conjunction with COMPLEXIS 2017, IoTBDS 2017, CLOSER 2017 and SMARTGREENS 2017.
Registration to VEHITS allows free access to the COMPLEXIS, IoTBDS, CLOSER and SMARTGREENS conferences (as a non-speaker).

 

Upcoming Deadlines

Regular Paper Submission Extension: December 15, 2016
Regular Paper Authors Notification: February 14, 2017
Regular Paper Camera Ready and Registration: February 23, 2017
The purpose of the 3rd International Conference on Vehicle Technology and Intelligent Transport Systems (VEHITS) is to bring together engineers, researchers and practitioners interested in the advances and applications in the field of Vehicle Technology and Intelligent Transport Systems.
This conference focuses on innovative applications, tools and platforms in all technology areas such as signal processing, wireless communications, informatics and electronics, related to different kinds of vehicles, including cars, off-road vehicles, trains, ships, underwater vehicles, or flying machines, and the intelligent transportation systems that connect and manage large numbers of vehicles, not only in the context of smart cities but in many other application domains.

Conference Chair

Oleg GusikhinFord Motor Company, United States

PROGRAM CO-CHAIRS

Markus HelfertDublin City University, Ireland
António PascoalInstituto Superior Técnico, Portugal

Keynote Speakers

Cristina Olaverri MonrealUniversity of Applied Sciences Technikum Wien, Austria
João BarrosVeniam, Portugal
Emil VassevLero - The Irish Software Research Centre, UL, Limerick, Ireland

Doctoral Consortium

Chair: Helder Leite
Submission: February 21, 2017
Submission: February 21, 2017

 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library 


It is planned to publish a short list of revised and 
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

Technically Co-sponsored by:

IEEE   IEEE ITSS  


In Cooperation with:

ABVE   CVTA   APVE   EAFO  


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS  

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